in Bradford .
Written in English
M.B.A. dissertation. Typescript.
Additional Physical Format: Online version: American Management Association. Packaging Division. Power of packaging. New York  (OCoLC) Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly. Get this from a library! Power packaging. [David E Carter;] -- Packed into this useful reference are innovative package designs in categories ranging from beverages, clothing, and other consumer goods to electronics and industrial products. Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring.5/5(1).
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